ʻO nā mea hoʻāʻo maikaʻi nui a me nā ʻano opaipu lauwili:
1. E nānā i ka nui a me ke ʻano o ka paipu kila
(1) Nānā mānoanoa o ka pā paipu kila: micrometer, ultrasonic mānoanoa ana, ʻaʻole emi ma lalo o 8 mau helu ma nā ʻaoʻao ʻelua a me ka moʻolelo.
(2) ʻO ke anawaena o waho o ka paipu kila a me ka nānā ʻana i ka ovality: nā ana calliper, nā kaliper vernier, a me nā ana apo e ana i nā kiko nui a liʻiliʻi.
(3) Ka nānā 'ana i ka lō'ihi o ka paipu kila: ka lipine kila, ka lima, ke ana 'akomi lō'ihi.
(4) Ka nānā 'ana i ke degere piko o ka paipu kila: ruler, ruler level (1m), feeler gauge, a me ka laina lahilahi e ana i ke degere kulou no ka mika a me ke degere kulou piha.
(5) Ka nānā 'ana i ke kihi bevel a me ka ʻaoʻao pōpō o ka maka hope o ka paipu kila: ruler square, clamping plate.
2. Nānā i ka maikaʻi o ka ili opaipu lauwili
(1) Nānā kiʻi lima: ma lalo o nā kūlana kukui maikaʻi, e like me nā kūlana, e kaha ana i ka ʻike kuhikuhi, e hoʻohuli i ka paipu kila e nānā pono.ʻAʻole ʻae ʻia nā ʻaoʻao o loko a me waho o nā paipu kila maʻemaʻe e loaʻa nā māwae, nā ʻōpala, nā ʻōpala, ka ʻōwili a me ka delamination.
(2) ʻO ka hoʻāʻo hoʻomake ʻole nānā:
a.Ultrasonic flaw detection UT: He mea maʻalahi i ka ʻili a me nā hemahema o loko o nā mea like ʻole me nā mea like ʻole.
b.ʻO ka hoʻāʻo ʻana ʻo Eddy i kēia manawa ʻo ET (electromagnetic induction) ka mea maʻamau i nā hemahema kiko (hoole-shaped).
c.ʻO ka hoʻāʻo ʻana o ka Magnetic Particle MT a me ka Flux Leakage Testing: He kūpono ka hoʻāʻo ʻana no ka ʻike ʻana i nā hemahema o ka ʻili a kokoke i ka ʻili o nā mea ferromagnetic.
d.Electromagnetic ultrasonic flaw detection: No coupling medium is required, and it can be applied to high-temperature, high-speed, rough steel pipe surface flaw detection.
e.Penetrant flaw detection: fluorescence, waihoʻoluʻu, ʻike i nā hemahema o ka paipu kila.
3. Ka hoʻopili ʻana i ka haku melemele:ka nānā ʻana kemika, ka nānā ʻana mea kani (mea kani CS infrared, spectrometer heluhelu pololei, NO mea kani, etc.).
(1) Mea kani CS infrared: E noʻonoʻo i nā ferroalloys, nā mea hana kila, a me nā mea C a me S i ke kila.
(2) Heluhelu kikoʻī heluhelu pololei: C, Si, Mn, P, S, Cr, Mo, Ni, Cn, Al, W, V, Ti, B, Nb, As, Sn, Sb, Pb, Bi i nā laʻana nui.
(3) Mea hana N-0: ka nānā ʻana i ke kinoea N, O.
4. Nānā hana hoʻokele kila
(1) Ho'āʻo Tensile: e ana i ke koʻikoʻi a me ka deformation, e hoʻoholo i ka ikaika (YS, TS) a me ka helu plasticity (A, Z) o ka mea.ʻO ka ʻaoʻao paipu laʻana lōʻihi a me ka transverse, ke ʻano arc, ka laʻana pōʻai (￠10, ￠12.5) liʻiliʻi anawaena, pā lahilahi, anawaena nui, mamao calibration pā mānoanoa.Nānā: ʻO ka lōʻihi o ka hāpana ma hope o ka haki ʻana e pili ana i ka nui o ka laʻana GB/T 1760
(2) Impact test: CVN, notch C type, V type, work J value J/cm2 standard sample 10×10×55 (mm) non-standard sample 5×10×55 (mm).
(3) Ho'āʻo paʻakikī: Brinell hardness HB, Rockwell hardness HRC, Vickers hardness HV, etc.
(4) Ho'āʻo Hydraulic: kaomi ho'āʻo, ka manawa hoʻokūpaʻa kaomi, p=2Sδ/D.
5. Paipu kila ʻolekaʻina hana nānā
(1) Ho'āʻo hoʻopololei: hāpana pōʻaiapuni C-like sample (S/D>0.15) H=(1+2)S/(∝+S/D) L=40～100mm, hōʻemi deformation no kēlā me kēia ʻāpana lōʻihi=0.07～0.08
(2) Ho'āʻo huki huki: L=15mm, ʻaʻohe māwae i kūpono
(3) ʻO ka hoʻāʻo ʻana a me ka curling: ʻo ke kikowaena kikowaena he 30 °, 40 °, 60 °
(4) Ho'āʻo kūlou: Hiki iā ia ke hoʻololi i ka hoʻāʻo palahalaha (no nā paipu nui-diameter)
6. Metallographic kālailai opaipu lauwili
ʻO ka hoʻāʻo kiʻekiʻe kiʻekiʻe (microscopic analysis), ka haʻahaʻa haʻahaʻa haʻahaʻa (macroscopic analysis) hale kiaʻi-like hairline ho'āʻo e kālailai i ka nui o ka palaoa o ka non-metallic inclusions, hōʻike i nā kiko haʻahaʻa haʻahaʻa a me nā hemahema (e like me ka looseness, segregation, subcutaneous bubbles, etc. ), a nānā i ka helu, ka lōʻihi a me ka hāʻawi ʻana i nā laina lauoho.
ʻO ka hoʻonui haʻahaʻa haʻahaʻa (macro): ʻAʻole ʻae ʻia nā kiko keʻokeʻo keʻokeʻo i ʻike ʻia, hoʻopili ʻia, nā ʻōpū subcutaneous, ka huli ʻana o ka ʻili a me ka delamination ma ka nānā ʻana me ka hoʻonui haʻahaʻa i nā ʻāpana hoʻāʻo leaching acid leaching o nā paipu kila ʻole.
Hui mana kiʻekiʻe (microscopic): E nānā me kahi microscope electron mana kiʻekiʻe.ʻO ka hoʻāʻo ʻana o ka lauoho lauoho: e hoʻāʻo i ka helu, ka lōʻihi a me ka hāʻawi ʻana i nā lauoho lauoho.
ʻO kēlā me kēia pūʻulu o nā paipu kila maʻemaʻe e komo i ka hale hana e hui pū ʻia me kahi palapala hōʻoia maikaʻi e hōʻike ana i ka pono o nā mea i loko o ka pūʻulu o nā paipu kila ʻole.
Ka manawa hoʻouna: Sep-18-2023